What is the difference between nanosecond laser depaneling machine and picosecond laser cutting machine?

Nanosecond UV laser, with a common wavelength of 355nm, has a higher unit energy density after focusing, which can destroy the bond between the atoms of the material and split the material. This makes the processing of organic materials and the precision processing of various ceramics possible. It is widely used in soft board drilling and appearance cutting, circuit board cutting, ceramics and LTCC drilling and segmentation, etc. combined with the data processing software circuitcam and the device driving software dreamcreator, the processing path is changeable and the parameter setting is arbitrary, highlighting the advantages of UV laser.

However, although UV laser processing relies on the so-called photochemical mechanism, it is still inevitable to release heat. For the precise, micro and non-interference processing requirements of heat sensitive materials, for example, the forming of flex PCB with gold finger, the blind hole processing of thin bottom copper FPC, the drilling of side wall quality ceramics, the deep processing and micro processing of various metals, and the cutting and processing of glass, the effect is not ideal. In the processing process, local rapid heating, melting and vaporization are easy to cause defects such as burr, recrystallization, microcrack and so on.

The birth of picosecond laser gets rid of the thermal influence accompanying laser processing, and makes the laser technology enter the era of cold processing. In one second, light can reach the lunar surface from the earth, but in one picosecond, such high-speed light can only run over the distance of three hair diameters. Compared with nanosecond laser, if the total energy is equal, the laser peak power and energy density of a single picosecond laser pulse are thousands of times higher than that of a single nanosecond pulse, Almost all of them are above the processing threshold of any material. The same amount of energy is compressed and released within one thousandth of a nanosecond, with almost no transmission, refraction and heat conduction loss. As shown in the left figure, it is all used for "useful work" of processing materials. Even if the laser pulse with infrared wavelength is used, the thermal influence can be ignored. Picosecond laser can directly cut metal layer, copper foil layer, adhesive layer and PI / PET film layer, The cut surface is smooth and clean, the layers between different materials are clear and tidy, and there will be no common phenomena such as carbonization, micro shortness, glue shrinkage and nodulation in nanosecond laser cutting, which can be avoided in the process.

Our equipment can be equipped with flight processing module, scanning and cutting at the same time. Continuous scanning technology increases the effective processing time. The optimized high-performance ultrashort pulse laser source is matched with high-performance mobile system and series platforms suitable for different types of products, so as to optimize the processing speed and expand the production capacity. High performance machine, equipped with optical system, mobile system and material loading table according to the needs of high-end applications, is suitable for precision and micro processing, including top-level digital scanning galvanometer and high-precision telecentric lens, accurate camera positioning system, non-destructive linear mobile system granite base and multi-purpose fast loading table. It is not only suitable for repetitive mass production processing, but also convenient for single piece experimental exploration.