Comparison between laser depaneling machine technology and traditional technology

The technology application of PCB laser depaneling machine provides relatively more advantages for customers with high-quality and complex circuit board cutting needs. In addition to laser cutting, there are also some mechanical cutting technologies in the circuit board depaneling technology, which is the mainstream technology of the depaneling process in the past. Different PCB cutting technologies have different precision, cost and quality. The specific selection depends on the specific product.

Generally speaking, the PCB depaneling process is at the end of the assembly line. The depaneling process is to cut and separate a single product from a larger panel circuit board.

Sawing: in the sawing process, use the saw blade to cut the assembled circuit board. Sawing technology can only deal with linear contour. In the process, for products whose mechanical stress and dust are not decisive standards, this sawing technology will cut rectangular circuit boards very fast.

Die punching: using this technology, the circuit board is cut by die, and its technical principle is based on shear force cutting. If the quantity of products is particularly large, and the design is fixed without special requirements for mechanical stress, the die is the first choice for this kind of products.

Milling: This is a machining technology. During the machining process, the material is removed through the high-speed rotating milling head. The use of milling technology requires that there are no sensitive components near the cutting breakpoint.

Especially for simple circuit board shape depaneling, the traditional depaneling technology, such as milling and sawing, is the preferred solution. However, in recent years, laser PCB cutting technology has attracted more and more attention and has been continuously developed and improved. At the same time, due to the continuous improvement of customers' requirements for depaneling technology and quality, laser PCB cutting technology has attracted more and more attention. Compared with mechanical depaneling technology, the cost performance of laser cutting technology continues to improve, which can be comparable to or even surpass mechanical depaneling technology. Another challenge in the electronic product manufacturing industry is the diversity of product types. Urgent orders, frequent design changes and small batch manufacturing requirements all put forward new requirements for highly flexible production processes. Therefore, laser PCB depaneling technology is a more favorable solution.

In the application technology of circuit board laser cutting, each laser pulse accurately removes the material target area. Therefore, laser cutting of materials is carried out layer by layer. Theoretically, this means that the laser can process almost any thickness of circuit board, and any complex contour can be removed layer by layer from hard board, soft board and soft hard combination board. Based on the principle of laser layer by layer material removal, in addition to cutting, more processing applications can be carried out. For example, only the material surface can be processed, similar to laser marking; Alternatively, a laser is used to remove the copper layer to form a metal circuit. By setting different laser parameters, the laser cutting technology can also process circuit boards of different materials and thicknesses at the same time.

The above is the whole content of the comparison between the technology of circuit board laser PCB depanelizer and traditional technology. Buy relevant laser PCB depanelizer equipment. Welcome to Fusen for consultation.