Introduction of PCB laser cutting machine

PCB depaneling is an important process in the production process of mass electronic assembly. In order to improve the output of printed circuit board (PCB) manufacturing and the linear speed of surface mount (SMT), the printed circuit board is usually designed as a large board, which will be divided into many smaller single PCB small boards by using PCB cutting machine equipment in the final product. This large PCB board can be called connecting board or panel. They are divided into small pieces. In different product processes, it may be divided after SMT, after ICT, after welding through-hole SMT, or before the final product assembly.

PCB depaneling machine is a machine used in the process of continuous cutting of PCB. The quality of traditional manual folding is uncontrollable, and there are hidden dangers for the work safety of folding personnel. However, due to the uneven force of manual folding and the difference of folding angle position, PCB electrical circuit, parts and tin track are damaged and components fall off, Copper foil deformation and plate falling off and other short service life and adverse phenomena.

Compared with the quality problem of traditional manual folding, the emergence of PCB laser cutting machine makes up for this disadvantage. PCB laser cutting machine has obvious advantages. It has high work efficiency in production. PCB depaneling machine is very safe when working. Any enterprise should pay attention to the production safety of products in addition to the quality of products, This process has been mandatory by European and American customers as early as 2004.

The principle of PCB laser cutting machine is to irradiate the surface of PCB circuit board with high-energy beam, and realize the vaporization cutting of PCB materials by controlling the parameters such as beam energy density, frequency, speed and processing times.

Some friends wonder whether such high-temperature processing will melt and blacken the surface of PCB materials. The answer is yes and No. The early PCB laser depaneling machine cutting was processed by CO2 laser. The light spot of this light source was thick and had a great thermal impact. Some PCB materials did not absorb the laser at the wavelength of 10.6 microns well, which was easy to appear similar to coking. With the continuous improvement of laser technology and the continuous increase of green light and UV laser power, it has been introduced into the PCB circuit board sub board industry and has been fully applied.