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What is the breakthrough of FPC laser cutting machine?

Jan 26 , 2022
What is the breakthrough of FPC laser cutting machine?

FPC undertakes the link carrier of electronic components and is widely used in mobile electronic products, liquid crystal screens, medical treatment, aerospace and other fields. Its lightness, bendability and wear resistance make it active in various fields for a long time. However, any product has to go through the period of beginning, development, climax, decline and elimination. FPC products are in the region between climax and decline. Before there is no product to replace flexible board, if flexible board wants to continue to occupy market share, it must innovate.

FPC product innovation needs to be improved in terms of thickness, folding resistance, process level and price.

Thickness: it needs to be more flexible and thinner; Folding resistance: it needs to withstand more than 10000 folds and bends, and better base materials are needed; Process level: improve the process requirements of minimum spacing, minimum linewidth and minimum hole spacing to meet the needs of large-scale circuits; Price: control the cost, open up wider application channels and open up new market applications.

While improving FPC products, as a necessary tool for FPC laser cutting and PCB depaneling, it also needs to adapt to new needs and improve synchronously. Fusen believes that breakthroughs need to be made in three aspects to ensure the competitive advantage of FPC laser cutting machine:


1. Ultrashort pulse direction
The conventional FPC laser cutting machine adopts nanosecond UV laser, which will produce slight carbonization black edge in the process of cutting FPC. In the new application scenario of large-scale integrated circuit, the carbonization particles will affect its performance under the micro circuit and cause micro short circuit.

Ultrashort pulse 355nm picosecond UV laser cutting machine solves the problem of carbonization black edge in the process of FPC cutting. The edge is smooth and neat, without carbonization area and carbonization particles, and effectively solves the problem of micro short circuit. It should be noted that since the ultra short pulse picosecond UV laser cutting FPC products, the price of nanosecond UV FPC laser cutting machine has decreased significantly. The cost of the same picosecond UV laser cutting machine is high. In the future, it is necessary to control the cost and improve the efficiency in the direction of ultra short pulse laser cutting machine.

2. Automation direction
In order to cooperate with the development of intelligent factory, FPC laser cutting machine enterprises must also face the development of automation supporting facilities, which is not limited to this. From the perspective of a whole line, it is necessary to design and develop the supporting use of the whole line, improve stability and achieve the purpose of controllable cost. Automation is the trend of all walks of life and a necessary way. At this time, it is a good time for enterprises to show their skills. Transformation is inevitable and the hope of success.


3. New products
FPC products are developing, but they are also facing the problem of decline. FPC laser cutting machine should not become a situation of prosperity and loss. From the perspective of market research and development stage, a product that can replace FPC is taking shape. FPC laser cutting machine also needs to follow the footsteps of a new generation of products, conduct synchronous research and development, and start at the front end of large-scale applications to prepare for the outbreak of the industry.

As a tool, FPC laser cutting system has strong vitality, but it can not avoid the wheels of the beginning, development, climax, decline and elimination period. Then we can only prolong the climax period through innovation and develop new technologies through the follow-up of new products. Therefore, we have been moving forward. The next issue will introduce a molding and laser etching method that can replace FPC products. 

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